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Feature of Thermal Camera Module:
The LGC6122 uncooled infrared module is a small-sized, lightweight and low-power localized solution.
It supports a variety of serial communication and video output interfaces, and provides a variety of lightweight infrared lenses to choose from. The product has good anti-vibration and anti-shock performance.
We provide infrared imaging solutions for small handheld telescopes, helmet night vision devices, lightweight unmanned aerial vehicle (UAV) systems, and multiple fusion optronics systems.
At the same time, it can meet the product development needs of optoelectronic pods, vehicle-mounted applications, and aiming devices that require high reliability.
Thermal Camera Module Parameters:
Performance indicators | Detector Type | Vanadium Oxide Uncooled Infrared Focal Plane Detector |
Detector Pixel | 640x512 | |
Image Element Size | 12μm | |
Working band | 8μm~14μm | |
NETD | ≤40mk@25℃ , F#1.0 | |
TEC | No | |
Thermal Response Times | ≤12ms | |
Non-uniformity correction | Support for TECLESS algorithm | |
Self-testing time | ≤6s | |
Start-up time | ≤15s | |
Single-point calibration time | ≤1.5s | |
Picture delay | ≤5ms | |
Image non-uniformity | σ≤15/1% | |
Function indicator | Polarity | Black heat/white heat |
False coloration | Support | |
Electronically variable (zoom) | 1.0~4.0x continuous zoom (step 0.1) | |
Image processing | Nonuniformity correction | |
Tecless | ||
Time domain filter | ||
Digital Detail Enhancement | ||
Image mirroring | Left/right/up/down/diagonal | |
Environment | Working temperature | -40℃~+60℃ |
Storage temperature | -45℃~+85℃ | |
Interface Parameter | Analog video | 1-way PAL |
Digital video | BT.656 | |
LVDS_F | ||
LVDS_H | ||
LVCMOS | ||
Digital video | LVDS/Cameralink/SDI/BT1120/GMSL/CML | |
Serial communications interface | 2-way UART(3.3V) | |
Button | 4 | |
Other | Weight | 35±5g |
Feature of Thermal Camera Module:
The LGC6122 uncooled infrared module is a small-sized, lightweight and low-power localized solution.
It supports a variety of serial communication and video output interfaces, and provides a variety of lightweight infrared lenses to choose from. The product has good anti-vibration and anti-shock performance.
We provide infrared imaging solutions for small handheld telescopes, helmet night vision devices, lightweight unmanned aerial vehicle (UAV) systems, and multiple fusion optronics systems.
At the same time, it can meet the product development needs of optoelectronic pods, vehicle-mounted applications, and aiming devices that require high reliability.
Thermal Camera Module Parameters:
Performance indicators | Detector Type | Vanadium Oxide Uncooled Infrared Focal Plane Detector |
Detector Pixel | 640x512 | |
Image Element Size | 12μm | |
Working band | 8μm~14μm | |
NETD | ≤40mk@25℃ , F#1.0 | |
TEC | No | |
Thermal Response Times | ≤12ms | |
Non-uniformity correction | Support for TECLESS algorithm | |
Self-testing time | ≤6s | |
Start-up time | ≤15s | |
Single-point calibration time | ≤1.5s | |
Picture delay | ≤5ms | |
Image non-uniformity | σ≤15/1% | |
Function indicator | Polarity | Black heat/white heat |
False coloration | Support | |
Electronically variable (zoom) | 1.0~4.0x continuous zoom (step 0.1) | |
Image processing | Nonuniformity correction | |
Tecless | ||
Time domain filter | ||
Digital Detail Enhancement | ||
Image mirroring | Left/right/up/down/diagonal | |
Environment | Working temperature | -40℃~+60℃ |
Storage temperature | -45℃~+85℃ | |
Interface Parameter | Analog video | 1-way PAL |
Digital video | BT.656 | |
LVDS_F | ||
LVDS_H | ||
LVCMOS | ||
Digital video | LVDS/Cameralink/SDI/BT1120/GMSL/CML | |
Serial communications interface | 2-way UART(3.3V) | |
Button | 4 | |
Other | Weight | 35±5g |